Chip Quik TS391SNL250 Thermally Stable Solder Paste No-Clean Sn96.5/Ag3.0/Cu0.5 T4 (250g jar)
Product details
| Management number | 209981531 | Release Date | 2026/04/02 | List Price | $27.98 | Model Number | 209981531 | ||
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| Category | |||||||||
Lead-Free / RoHS 3 Compliant / REACH Compliant Description Chip Quik TS [Thermally Stable] Solder Paste No-Clean Lead-Free SAC305 in 250g jar. Revolutionary Formula: No Refrigeration Required! Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Content: 88.5% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 217-220C (423-428F) Size: 250g jar Shelf Life Refrigerated >12 months, unrefrigerated >12 months Stencil Life >12 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Store at room temperature 20-25C (68-77F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its operating temperature (room temperature) of 20-25C (68-77F), therefore no warming time is required before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
- Solder Paste
| Material | lead |
|---|---|
| Item Weight | 8 ounces |
| Part Number | TS391SNL250 |
| Manufacturer | Chip Quik® |
| Batteries Included | No |
| Batteries Required | No |
| Package Dimensions | 2.5 x 2.5 x 2 inches |
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